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Industrial automation product case study - Semiconductor

Fully Automatic Chip Bagging and Vacuum Sealing Machine
[Applicable Scenarios]: Semiconductor tape and reel packaging process
[Main Functions]: Automatic feeding (Reel, aluminum foil bags, desiccant, humidity indicator card, label, etc.)
[Technical Parameters]: C/T: 350 R/H; FP: 2450x1350x1840;
Main Features:
[Efficiency]: Fully automated, high operating speed, non-stop feeding
[Quality]: 100% anti-mixing, all-round barcode matching, humidity indicator card detection
[Features]: Intelligent bag selection, intelligent labeling, flexible MES system and traceability guarantee

Keyword:

Industrial automation product case study - Semiconductor

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Product Introduction

Fully Automatic Chip Bagging and Vacuum Sealing Machine

[Applicable Scenarios]: Semiconductor tape and reel packaging process

[Main Functions]: Automatic feeding (Reel, aluminum foil bags, desiccant, humidity indicator card, label, etc.)

[Technical Parameters]: C/T: 350 R/H; FP: 2450x1350x1840;

Main Features:

[Efficiency]: Fully automated, high operating speed, non-stop feeding

[Quality]: 100% anti-mixing, full-range barcode comparison, humidity indicator card detection

[Features]: Intelligent bag selection, intelligent labeling, flexible MES system and traceability guarantee

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