Machine vision product case
Semi-automatic Chip Inspection System
[Applicable Scenarios]: Manual spot checks for semiconductor Wire-Bond/Die-Bond processes (single machine replaces multiple microscopes)
[Main Functions]: Automatic magazine loading, multi-angle shooting, high-magnification display, automatic/manual transfer frame for easy inspection, screen-assisted scale display for easy measurement and judgment [Technical Parameters]: Camera resolution: 2 million - 5 million pixels; Lens magnification: 10x - 50x
Dimensions: 1800mm x 4500mm; Number of operators: 1.
[Applicable Scenarios]: Manual spot checks for semiconductor Wire-Bond/Die-Bond processes (single machine replaces multiple microscopes)
[Main Functions]: Automatic magazine loading, multi-angle shooting, high-magnification display, automatic/manual transfer frame for easy inspection, screen-assisted scale display for easy measurement and judgment [Technical Parameters]: Camera resolution: 2 million - 5 million pixels; Lens magnification: 10x - 50x
Dimensions: 1800mm x 4500mm; Number of operators: 1.
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Machine vision product case
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Product Introduction
Semi-automatic chip inspection system
[Applicable scenarios]: Manual spot check of semiconductor Wire-Bond/Die-Bond processes (single machine replaces multiple microscopes)
[Main functions]: Automatic magazine loading, multi-angle shooting, high-magnification display, automatic/manual transplanting frame for easy inspection, screen-assisted scale display for easy measurement and judgment
[Technical parameters]: Camera resolution: 2 million - 5 million pixels; Lens magnification: 10x - 50x
Dimensions: 1800mm x 4500mm; Number of operators: 1.
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